Siemens today announced Tessent™ Silicon Executable software, a standalone application designed to translate test patterns and apply them directly onto high-speed interfaces and protocols. The ecosystem includes leading test provider partners who will embed the Tessent software within the automated test equipment providing a simplified workflow and enhanced productivity.
Tessent Silicon Executable extends the Tessent workflow from design-for-test insertion, pattern generation, and test collateral creation into pattern execution in silicon. It consumes Tessent-generated collateral, applies tests through the target execution environment, and returns results that downstream Tessent debug, diagnosis and analysis flows can use.
“Semiconductor testing is at an inflection point requiring new scan test delivery methods while minimizing time-to-ramp for a product to release to market. The combination of silicon complexity, multi-die and new transistor technology is driving a growth in test content,” said Ankur Gupta, executive vice president and Head of IC, Siemens EDA, Siemens Digital Industries Software. “Tessent Silicon Executable software is embedded in test equipment to directly connect test creation and execution, helping customers apply Tessent-generated patterns consistently and return results to established debug, diagnosis and analysis workflows across test environments. This enables a new level of correlation between environments and provides optimized product economics for device manufacturing”
As semiconductor designs increase in complexity and operating frequency, traditional test methods can face longer test times and more demanding execution requirements. Tessent Silicon Executable software is designed to simplify test pattern application, support high-speed interface-based testing and provide a consistent approach across automated test equipment, system-level test, bench and in-system environments.
Tessent Silicon Executable launches in collaboration with automated test equipment providers Advantest and Teradyne.
“Advantest works with all major EDA vendors to address increasing device complexity and coverage gaps with a seamless workflow across the silicon lifecycle,” said Juergen Serrer, CTO of Advantest. “By integrating Siemens TSE into our V93000 platform with Link Scale and extending it into pre-silicon verification and DFT lab engineering with SiConic, we provide customers with a uniquely consistent path from development to production.”
"In advanced packaging, how test content reaches the device matters as much as the content itself," said Shannon Poulin, president, Semiconductor Test group, Teradyne. "By integrating Siemens’ Tessent Silicon Executable into our UltraPort instrument for UltraFLEXplus, we are the first tester company to give customers a standard path to run SSN over PCIe for industry-leading PCIe Gen 6 interfaces, which dramatically improves performance and reduces test times.”
Tessent Silicon Executable software is part of the broader Tessent ecosystem for semiconductor design-for-test, silicon test, debug, diagnosis and analysis. To learn more about Tessent Silicon Executable software, visit https://www.siemens.com/en-us/products/ic/tessent/yield-learning/silicon-executable/
