Siemens Digital Industries Software announced today that Teamcenter® Semiconductor Lifecycle Management (SLCM) software was adopted by Rapidus Corporation.
Teamcenter SLCM and a data-driven development approach will help Rapidus to seamlessly connect design, development, manufacturing preparation, testing and quality management - including quality improvement and business productivity and to become the fastest startup of advanced logic device prototypes and mass production and a stable supply to the global market.
Teamcenter SLCM and its standard semiconductor-specific data models support to seamlessly connect operations and data, creating an environment where all stakeholders can immediately access necessary information and visualize task progress and schedules across departments.
Teamcenter SLCM can be used out-of-the-box with minimal customization, not only shortening the implementation period and enabling immediate use but also facilitates the gradual incorporation of rapidly evolving AI technology, minimizing costs associated with version upgrades and allowing immediate adoption of new features. In addition, for quality management, Process Design Kit (PDK), Bill of Process (BOP), and quality control can be centrally managed within PLM using standard out of the box capabilities. With data linked across processes, operational productivity is enhanced while maximizing quality improvement, gaining yield improvements and facilitating knowledge accumulation and reuse.
“Rapidus is a symbol of the revitalization of Japan’s semiconductor industry as well as Japan’s pursuit of a game-changing technology and ecosystem for semiconductor. We feel honored to work with and support Rapidus to achieve their goals to mass produce leading-edge 2nm chips by enabling data-driven development approach,” said Kunihiko Horita, country manager and vice president for Japan, Siemens Digital Industries Software.
To learn more about Teamcenter Semiconductor Lifecycle Management and how it is helping companies of all sizes to overcome the complex challenges facing chipmakers with unified end-to-end solutions for effective management across all lifecycle stages, visit: https://www.sw.siemens.com/en-US/digital-thread/integrated-lifecycle-management/semiconductor/